上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
222-3343-00-0602JCONN IC DIP SOCKET ZIF 22POS GLD 3M |
16 |
|
规格书 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
228-1290-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD 3M |
26 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
242-1281-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD 3M |
25 |
|
规格书 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
228-4817-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD 3M |
35 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
242-1293-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD 3M |
15 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
240-3639-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
17 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
220-7201-55-1902CONN SOCKET SOIC 20POS GOLD 3M |
23 |
|
规格书 |
Textool™ | Bulk | Active | SOIC | 20 (2 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
242-1289-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD 3M |
14 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
228-7396-55-1902CONN SOCKET SOIC 28POS GOLD 3M |
19 |
|
规格书 |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
228-7474-55-1902CONN SOCKET SOIC 28POS GOLD 3M |
15 |
|
规格书 |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
