上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8432-11B1-RK-TPCONN SOCKET PLCC 32POS TIN 3M |
627 |
|
规格书 |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8428-21B1-RK-TRCONN SOCKET PLCC 28POS TIN 3M |
2,750 |
|
规格书 |
8400 | Tape & Reel (TR) | Active | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8444-21A1-RK-TPCONN SOCKET PLCC 44POS TIN 3M |
216 |
|
规格书 |
8400 | Tube | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8452-21B1-RK-TPCONN SOCKET PLCC 52POS TIN 3M |
1,883 |
|
规格书 |
8400 | Tube | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8468-21B1-RK-TPCONN SOCKET PLCC 68POS TIN 3M |
2,073 |
|
规格书 |
8400 | Tube | Active | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8468-21A1-RK-TPCONN SOCKET PLCC 68POS TIN 3M |
713 |
|
规格书 |
8400 | Tube | Active | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8484-21B1-RK-TPCONN SOCKET PLCC 84POS TIN 3M |
767 |
|
规格书 |
8400 | Tube | Active | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8468-21B1-RK-TRCONN SOCKET PLCC 68POS TIN 3M |
469 |
|
规格书 |
8400 | Tape & Reel (TR) | Active | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8484-11B1-RK-TPCONN SOCKET PLCC 84POS TIN 3M |
388 |
|
规格书 |
8400 | Tube | Active | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
240-1288-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
40 |
|
规格书 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
