IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    251-5949-01-0602

    251-5949-01-0602

    CONN ZIG-ZAG ZIF 51POS GOLD

    3M

    7
    251-5949-01-0602

    规格书

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    256-1292-00-0602J

    256-1292-00-0602J

    CONN IC DIP SOCKET ZIF 56POS GLD

    3M

    13
    256-1292-00-0602J

    规格书

    Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    260-4204-01

    260-4204-01

    CONN SOCKET QFN 60POS GOLD

    3M

    14
    260-4204-01

    规格书

    Textool™ Bulk Active QFN 60 (4 x 15) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    224-7397-55-1902

    224-7397-55-1902

    CONN SOCKET SOIC 24POS GOLD

    3M

    16
    224-7397-55-1902

    规格书

    Textool™ Bulk Active SOIC 24 (2 x 12) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    220-3342-00-0602J

    220-3342-00-0602J

    CONN IC DIP SOCKET ZIF 20POS GLD

    3M

    0
    220-3342-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    240-1280-00-0602J

    240-1280-00-0602J

    CONN IC DIP SOCKET ZIF 40POS GLD

    3M

    0
    240-1280-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    232-5205-01

    232-5205-01

    CONN SOCKET QFN 32POS GOLD

    3M

    0
    232-5205-01

    规格书

    Textool™ Bulk Active QFN 32 (4 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    224-1286-00-0602J

    224-1286-00-0602J

    CONN IC DIP SOCKET ZIF 24POS GLD

    3M

    0
    224-1286-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    224-5248-00-0602J

    224-5248-00-0602J

    CONN IC DIP SOCKET ZIF 24POS GLD

    3M

    0
    224-5248-00-0602J

    规格书

    Textool™ Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    214-7390-55-1902

    214-7390-55-1902

    CONN SOCKET SOIC 14POS GOLD

    3M

    1
    214-7390-55-1902

    规格书

    Textool™ Bulk Active SOIC 14 (2 x 7) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
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