图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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272-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 72 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2184-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 184 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2141-6321-9UA-1902TEST AND BURN-IN PGA 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 141 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2192-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 192 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2280-6319-9UA-1902TEXTOOL 3M |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 280 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2145-6315-9UA-1902BURN-IN GRID ZIP SOCKET 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 145 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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256-6313-9UA-1902PGA 13 X 13 3M |
0 |
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![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 56 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |