上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4842-6000-CPCONN IC DIP SOCKET 42POS TIN 3M |
1,520 |
|
- |
4800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
4824-6004-CPCONN IC DIP SOCKET 24POS TIN 3M |
3,488 |
|
规格书 |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
4840-6000-CPCONN IC DIP SOCKET 40POS TIN 3M |
1,737 |
|
规格书 |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
4840-6004-CPCONN IC DIP SOCKET 40POS TIN 3M |
2,195 |
|
规格书 |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
4848-6000-CPCONN IC DIP SOCKET 48POS TIN 3M |
155 |
|
规格书 |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
4848-6004-CPCONN IC DIP SOCKET 48POS TIN 3M |
471 |
|
规格书 |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
8420-11B1-RK-TPCONN SOCKET PLCC 20POS TIN 3M |
1,048 |
|
规格书 |
8400 | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8420-21B1-RK-TPCONN SOCKET PLCC 20POS TIN 3M |
3,538 |
|
规格书 |
8400 | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8428-21B1-RK-TPCONN SOCKET PLCC 28POS TIN 3M |
2,470 |
|
规格书 |
8400 | Tube | Active | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
8428-11B1-RK-TPCONN SOCKET PLCC 28POS TIN 3M |
862 |
|
规格书 |
8400 | Tube | Active | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
