IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    216-3340-00-0602J

    216-3340-00-0602J

    CONN IC DIP SOCKET ZIF 16POS GLD

    3M

    565
    216-3340-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    208-7391-55-1902

    208-7391-55-1902

    CONN SOCKET SOIC 8POS GOLD

    3M

    298
    208-7391-55-1902

    规格书

    Textool™ Bulk Active SOIC 8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    248-1282-00-0602J

    248-1282-00-0602J

    CONN IC DIP SOCKET ZIF 48POS GLD

    3M

    614
    248-1282-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    216-7224-55-1902

    216-7224-55-1902

    CONN SOCKET SOIC 16POS GOLD

    3M

    228
    216-7224-55-1902

    规格书

    Textool™ Bulk Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    203-2737-55-1102

    203-2737-55-1102

    CONN TRANSIST TO-3/TO-66 3POS

    3M

    72
    203-2737-55-1102

    规格书

    Textool™ Bulk Active Transistor, TO-3 and TO-66 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
    264-4493-00-0602J

    264-4493-00-0602J

    CONN IC DIP SOCKET ZIF 64POS GLD

    3M

    37
    264-4493-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    240-5205-01

    240-5205-01

    CONN SOCKET QFN 40POS GOLD

    3M

    27
    240-5205-01

    规格书

    Textool™ Bulk Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    4808-3000-CP

    4808-3000-CP

    CONN IC DIP SOCKET 8POS TIN

    3M

    24,688
    4808-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    4816-3000-CP

    4816-3000-CP

    CONN IC DIP SOCKET 16POS TIN

    3M

    11,180
    4816-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    4814-3004-CP

    4814-3004-CP

    CONN IC DIP SOCKET 14POS TIN

    3M

    9,841
    4814-3004-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
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