上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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200-6313-9UN-1900CONN SOCKET PGA ZIF 169POS GOLD 3M |
0 |
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规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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200-6315-9UN-1900CONN SOCKET PGA ZIF 225POS GOLD 3M |
0 |
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规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | - | - | - | 0.100" (2.54mm) | - | - | - | Polyethersulfone (PES) | -55°C ~ 150°C |
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200-6317-9UN-1900CONN SOCKET PGA ZIF 289POS GOLD 3M |
0 |
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规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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100-006-000CONN IC DIP SOCKET 6POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-008-000CONN IC DIP SOCKET 8POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-008-001CONN IC DIP SOCKET 8POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-010-000CONN IC DIP SOCKET 10POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-014-000CONN IC DIP SOCKET 14POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-014-001CONN IC DIP SOCKET 14POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-016-000CONN IC DIP SOCKET 16POS GOLD 3M |
0 |
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规格书 |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
