上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1035-2-1152-0B-00TEXTOOLTEST & BURN-IN BALL GRID 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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1025-2-0572-0B-00TEXTOOLTEST & BURN-IN BALL GRID 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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79300-20-0093M TEXTOOL FLEXIBLE ARRAY SOLUTI 3M |
0 |
|
- |
Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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7100287881TEXTOOLFLEXIBLE ARRAY SOLUTIONS 3M |
0 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
7010390893983-10 DOT IN-LN2"ES 6"X150YD-IN 3M |
0 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
216-6278-00-3303CONN IC DIP SOCKET ZIF 16POS GLD 3M |
0 |
|
规格书 |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD 3M |
0 |
|
规格书 |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
|
|
218-7223-55-1902CONN SOCKET SOIC 18POS GOLD 3M |
0 |
|
规格书 |
Textool™ | Bulk | Active | SOIC | 18 (2 x 9) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
|
200-6310-9UN-1900CONN SOCKET PGA ZIF 100POS GOLD 3M |
0 |
|
规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 100 (10 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
200-6311-9UN-1900CONN SOCKET PGA ZIF 121POS GOLD 3M |
0 |
|
规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 121 (11 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
