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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度
    SMD291SNL10T5

    SMD291SNL10T5

    SOLDER PASTE LF T5 10CC

    Chip Quik Inc.

    10
    SMD291SNL10T5

    规格书

    - Dispenser Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD291AX250T3

    SMD291AX250T3

    SOLDER PASTE SN63/PB37 250G

    Chip Quik Inc.

    38
    SMD291AX250T3

    规格书

    - Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    BARSN99.3CU0.7

    BARSN99.3CU0.7

    SOLDER BAR SN99.3/CU0.7 1LB SUPE

    Chip Quik Inc.

    28
    BARSN99.3CU0.7

    规格书

    Super Low Dross™ Bulk Active Bar Solder Sn99.3Cu0.7 (99.3/0.7) - 441°F (227°C) - - - Lead Free Bar, 1 lb (454g) - - -
    SMD291SNL250T3

    SMD291SNL250T3

    SOLDER PASTE SAC305 250G T3

    Chip Quik Inc.

    6
    SMD291SNL250T3

    规格书

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD291SNL250T4

    SMD291SNL250T4

    SLDR PST NO-CLEAN SAC305 T4 250G

    Chip Quik Inc.

    13
    SMD291SNL250T4

    规格书

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD4300SNL250T4

    SMD4300SNL250T4

    SLDR PST WATR SOL SAC305 T4 250G

    Chip Quik Inc.

    6
    SMD4300SNL250T4

    规格书

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391SNL250

    TS391SNL250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    12
    TS391SNL250

    规格书

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    SMDLTLFP250T3

    SMDLTLFP250T3

    SOLDER PASTE SN42/BI58 250G

    Chip Quik Inc.

    4
    SMDLTLFP250T3

    规格书

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMDLTLFP250T4

    SMDLTLFP250T4

    SOLDER PASTE LOW TEMP T4 250G

    Chip Quik Inc.

    6
    SMDLTLFP250T4

    规格书

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391LT250

    TS391LT250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    18
    TS391LT250

    规格书

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
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