上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDLTLFPSOLDER PASTE LOW TEMP 5CC W/TIP Chip Quik Inc. |
98 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391AXTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
41 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD291SNLSOLDER PASTE NO-CLEAN LF 5CC SYR Chip Quik Inc. |
37 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LTTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
87 |
|
规格书 |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD291SNL50T3SLDR PASTE NO-CLN SAC305 50G Chip Quik Inc. |
58 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391SNLTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
35 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
TS391SNL50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
60 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDSWLF.031 2OZSLD WIRE NO-CLEAN 96.5/3/.5 2OZ. Chip Quik Inc. |
92 |
|
规格书 |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
SMDIN97AG3INDIUM SOLDER WIRE (IN97/AG3) 0. Chip Quik Inc. |
69 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | In97Ag3 (97/3) | 0.031" (0.79mm) | 289°F (143°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | 24 Months | Date of Manufacture | - |
|
SMD291AX10SOLDER PASTE NO-CLEAN 63/37 10CC Chip Quik Inc. |
39 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
