上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391LT50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
43 |
|
规格书 |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDLTLFP10SOLDER PASTE LOW TEMP 10CC W/TIP Chip Quik Inc. |
33 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291AXT5SOLDER PASTE NO CLEAN 63SN/37PB Chip Quik Inc. |
23 |
|
规格书 |
SMD2 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
EXB-SN63PB37SOLDER BAR SN63/PB37 1LB (454G) Chip Quik Inc. |
20 |
|
规格书 |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
|
SMD291SNL10SOLDER PASTE NO-CLEAN 10CC SYR Chip Quik Inc. |
35 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LT10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
36 |
|
规格书 |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDIN66.3BI33.7INDIUM/BISMUTH SOLDER WIRE (IN66 Chip Quik Inc. |
36 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | In66.3Bi33.7 (66.3/33.7) | 0.031" (0.79mm) | 162°F (72°C) | - | - | - | Lead Free | Spool | 60 Months | Date of Manufacture | - |
|
SMDSWLF.031 4OZSLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc. |
32 |
|
规格书 |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMDLTLFP10T5SOLDER PASTE LOW TEMP LF T5 10CC Chip Quik Inc. |
40 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLTLFP32SOLDER WIRE LOW TEMP 42/57/1 32' Chip Quik Inc. |
85 |
|
规格书 |
- | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.030" (0.76mm) | 280°F (138°C) | - | 21 AWG, 22 SWG | - | Lead Free | - | - | - | - |
