焊料

    制造商 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度





















































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度
    CQ-SS-SNBIAG-0.76MM-25000

    CQ-SS-SNBIAG-0.76MM-25000

    SOLDER SPHERES SN42/BI57.6/AG0.4

    Chip Quik Inc.

    0
    CQ-SS-SNBIAG-0.76MM-25000

    规格书

    - Bulk Active Solder Sphere Bi57.6Sn42Ag0.4 (57.6/42/0.4) 0.030" (0.76mm) 280°F (138°C) - - - - Jar 24 Months Date of Manufacture -
    SMD291AX250T6

    SMD291AX250T6

    SOLDER PASTE IN JAR 250G (T6) SN

    Chip Quik Inc.

    0
    SMD291AX250T6

    规格书

    CHIPQUIK® Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - - Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture -
    JET551SNL30T5

    JET551SNL30T5

    JET PRINTING SOLDER PASTE SN96.5

    Chip Quik Inc.

    0
    JET551SNL30T5

    规格书

    CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - - - Syringe, 3.53 oz (100g) 12 Months Date of Manufacture -
    JET551LT30T5

    JET551LT30T5

    JET PRINTING SOLDER PASTE SN42/B

    Chip Quik Inc.

    0
    JET551LT30T5

    规格书

    CHIPQUIK® Bulk Active Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) - 280°F (138°C) No-Clean - - - Syringe, 3.53 oz (100g) 12 Months Date of Manufacture -
    TS991AX500T4

    TS991AX500T4

    SOLDER PASTE THERMALLY STABLE NC

    Chip Quik Inc.

    0
    TS991AX500T4

    规格书

    CHIPQUIK® Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 17.64 oz (500g) 12 Months Date of Manufacture -
    SMD291SNL500T3

    SMD291SNL500T3

    SOLDER PASTE SAC305 500G

    Chip Quik Inc.

    0
    SMD291SNL500T3

    规格书

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD291SNL500T3C

    SMD291SNL500T3C

    SOLDER PASTE NO-CLEAN SAC305 T3

    Chip Quik Inc.

    0
    SMD291SNL500T3C

    规格书

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD4300SNL500T3C

    SMD4300SNL500T3C

    SOLDER PASTE SAC305 T3 500G

    Chip Quik Inc.

    0
    SMD4300SNL500T3C

    规格书

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD2060

    SMD2060

    SOLDER SPHERES SAC305 .030 DIAM

    Chip Quik Inc.

    0
    SMD2060

    规格书

    SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.030" (0.76mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
    SMD2050

    SMD2050

    SOLDER SPHERES SAC305 .024 DIAM

    Chip Quik Inc.

    0
    SMD2050

    规格书

    SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.024" (0.61mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
    首页

    首页

    产品中心

    产品中心

    电话

    电话

    会员中心

    会员中心