上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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WWSWLT.040 200GSN42/BI57/AG1 2.5% NO-CLEAN WATE Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 7 oz (200g) | 60 Months | Date of Manufacture | - |
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SMDLTB35T4SOLDER PASTE SN60/BI40 T4 35G SY Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn60Bi40 (60/40) | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | - |
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NC191LTA50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
0 |
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规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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RMA591LT10RMA SOLDER PASTE SN42/BI57.6/AG0 Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | 280°F (138°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | - |
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SMDBI100-S-16SOLDER SHOT BI100 16OZ 454G Chip Quik Inc. |
0 |
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规格书 |
SMD | Bulk | Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - | - |
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SMD291AX10T6SOLDER PASTE NO CLEAN SN63/PB37 Chip Quik Inc. |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | - |
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JET551AX10T5JET PRINTING SOLDER PASTE SN63/P Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | - |
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JET551LT10T5JET PRINTING SOLDER PASTE SN42/B Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | - |
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JET551SNL10T5JET PRINTING SOLDER PASTE SN96.5 Chip Quik Inc. |
0 |
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规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | - |
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CQ-SS-SNBIAG-0.50MM-25000SOLDER SPHERES SN42/BI57.6/AG0.4 Chip Quik Inc. |
0 |
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规格书 |
- | Bulk | Active | Solder Sphere | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.020" (0.51mm) | 280°F (138°C) | - | - | - | - | Jar | 24 Months | Date of Manufacture | - |
