上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD-SC-SN81BI19-0.031-1OZSN81/BI19 .031" SOLDER WIRE 1OZ Chip Quik Inc. |
0 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Sn81Bi19 (81/19) | 0.031" (0.79mm) | 280°F ~ 401°F (138°C ~ 205°C) | - | - | - | Lead Free | Spool, 0.035 oz (1g) | 60 Months | Date of Manufacture | - |
|
|
SMD-SC-SN99AG1-0.031-1OZSN99/AG1 .031" SOLDER WIRE 1OZ S Chip Quik Inc. |
0 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Sn99Ag1 (99/1) | 0.031" (0.79mm) | 428°F ~ 446°F (220°C ~ 230°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | 60 Months | Date of Manufacture | - |
|
|
WWSWLT.040 10GSN42/BI57/AG1 2.5% NO-CLEAN WATE Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.35 oz (10g) | 60 Months | Date of Manufacture | - |
|
CQ100GEGERMANIUM DOPED SUPER LOW DROSS Chip Quik Inc. |
1 |
|
规格书 |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
|
WWSWLT.040 20GSN42/BI57/AG1 2.5% NO-CLEAN WATE Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.7 oz (20g) | 60 Months | Date of Manufacture | - |
|
|
NCSW.015 1LBSOLDER WIRE 63/37 TIN/LEAD (SN63 Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | - | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | - |
|
SMD291AX500T3SOLDER PASTE SN63/PB37 500G Chip Quik Inc. |
1 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2215SOLDER SPHERES 63/37 .030 DIAM Chip Quik Inc. |
1 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030" (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
|
WWSWLT.040 50GSN42/BI57/AG1 2.5% NO-CLEAN WATE Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1.8 oz (50g) | 60 Months | Date of Manufacture | - |
|
|
WWSWLT.040 100GSN42/BI57/AG1 2.5% NO-CLEAN WATE Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 3.53 oz (100g) | 60 Months | Date of Manufacture | - |
