上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391SNL500CTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD2040SOLDER SPHERES SAC305 .020 DIAM Chip Quik Inc. |
2 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2SWLT.040 100GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
7 |
|
规格书 |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
SMD2032SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2024SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2016SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
7 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMDLTLFP50T6SOLDER PASTE IN JAR 50G (T6) SN4 Chip Quik Inc. |
4 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | 280°F (138°C) | No-Clean | - | - | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
SMDAU80SN20-3INCH-0.762MMSOLDER WIRE (AU80/SN20) GOLD/TIN Chip Quik Inc. |
16 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Au80Sn20 (80/20) | 0.030" (0.76mm) | 526°F (280°C) | - | - | - | Lead Free | Spool | 60 Months | - | - |
|
TS391LT500CTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2 |
|
规格书 |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD291SNL500T5SOLDER PASTE SAC305 500G T5 Chip Quik Inc. |
2 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
