上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLT.047 8OZSOLDER WIRE SN42/BI57/AG1 .047" Chip Quik Inc. |
17 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMD291SNLT7SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
3 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 7 | - | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NCSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Spool, 1 lb (453.592g) | - | - | - |
|
SMDSWLF.008 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
20 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 32 AWG, 35 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - | - |
|
SMD2SWLT.040 50GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
6 |
|
规格书 |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 1.8 oz (50g) | - | - | - |
|
SMDSWLT.040 50GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
8 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1.8 oz (50g) | - | - | - |
|
SMDAL200ALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
2 |
|
规格书 |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Jar, 7.05 oz (200g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
4 |
|
规格书 |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMD291AX500T3CSOLDER PASTE NO-CLEAN 63/37 T3 5 Chip Quik Inc. |
4 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.020 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
16 |
|
规格书 |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
