上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
12 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
CQ100GE.031 1LBGERMANIUM DOPED SOLDER WIRE SN/C Chip Quik Inc. |
19 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2SWLF.031 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
7 |
|
规格书 |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDLTLFPT6SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
9 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | - | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
CQ100GE.020 1LBGERMANIUM DOPED SOLDER WIRE SN/C Chip Quik Inc. |
8 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
|
SMDIN52SN48-1.69X5.71-RINDIUM/TIN SOLDER RIBBON (IN52/S Chip Quik Inc. |
12 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | - | Lead Free | Spool | - | - | - |
|
SMDIN100-RINDIUM SOLDER RIBBON (IN100) 0.0 Chip Quik Inc. |
15 |
|
规格书 |
SMD | Bulk | Active | Ribbon Solder | In100 (100) | - | 315°F (157°C) | - | - | - | Lead Free | Spool | - | - | - |
|
RASWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
10 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | - |
|
NC191LT250T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
6 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA250T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
6 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
