上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2016-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
10 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMDSWLF.006 5GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
7 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.176 oz (5g) | - | - | - |
|
SMDSWLF.020 4OZSLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc. |
19 |
|
规格书 |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD3SW.020 4OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
6 |
|
规格书 |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
|
TS391SNL10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
17 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDSWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
23 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD2SWLT.040 20GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
7 |
|
规格书 |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - | - |
|
EXB-SN96.5AG3.0CU0.5-0.5LBSOLDER BAR SN96.5/AG3.0/CU0.5 0. Chip Quik Inc. |
32 |
|
规格书 |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 0.5 lb (227g) | - | - | - |
|
SMDSWLT.040 20GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
24 |
|
规格书 |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 0.7 oz (20g) | - | - | - |
|
NC4SW.031 1LBSOLDER WIRE 93.5/5/1.5 LEAD/TIN/ Chip Quik Inc. |
23 |
|
规格书 |
- | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
