上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XR2C-2002CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2A-4001-NCONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2T-2421-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2A-6411-NI.C. CONNECTOR SOCKET Omron Electronics Inc-EMC Div |
0 |
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- |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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XR2A-2815CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2C-1511-NCONN SOCKET SIP 15POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2E-3204CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Obsolete | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2H-1611-NCONN ZIG-ZAG 16POS GOLD Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | Zig-Zag | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2C-3200-HSGCONN IC SOCKET 32POS Omron Electronics Inc-EMC Div |
0 |
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规格书 |
XR2 | Bulk | Active | Housing | 32 (1 x 32) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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XR2A-2402CONN Omron Electronics Inc-EMC Div |
0 |
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- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
