IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    XR2C-2005

    XR2C-2005

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    5
    XR2C-2005

    规格书

    XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-4011-N

    XR2A-4011-N

    CONN IC DIP SOCKET 40POS GOLD

    Omron Electronics Inc-EMC Div

    8
    XR2A-4011-N

    规格书

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-2000-HSG

    XR2C-2000-HSG

    CONN IC SOCKET 20POS

    Omron Electronics Inc-EMC Div

    0
    XR2C-2000-HSG

    规格书

    XR2 Bulk Obsolete Housing 20 (1 x 20) 0.100" (2.54mm) - - Beryllium Copper - Closed Frame Solder 0.100" (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-1611-N

    XR2C-1611-N

    CONN SOCKET SIP 16POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2C-1611-N

    规格书

    XR2 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C2611N

    XR2C2611N

    CONN SOCKET SIP 26POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2C2611N

    规格书

    XR2 Bulk Obsolete SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-1425

    XR2A-1425

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2A-1425

    规格书

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-1601-N

    XR2A-1601-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    0

    -

    * Bulk Active - - - - - - - - - - - - - - -
    XR2A-2001-N

    XR2A-2001-N

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2A-2001-N

    规格书

    XR2 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-1621-N

    XR2T-1621-N

    CONN IC DIP SOCKET 16POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2T-1621-N

    规格书

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2201-N

    XR2A-2201-N

    CONN IC DIP SOCKET 22POS GOLD

    Omron Electronics Inc-EMC Div

    0
    XR2A-2201-N

    规格书

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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