上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2A-2411-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
97 |
|
规格书 |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2P2041CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
96 |
|
规格书 |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2A-3201-NCONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div |
55 |
|
规格书 |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2C-3205CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
95 |
|
规格书 |
XR2 | Bulk | Active | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2C-2015CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
43 |
|
规格书 |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2T-2021-NCONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div |
0 |
|
规格书 |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
0 |
|
规格书 |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2A-0802CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
54 |
|
规格书 |
XR2 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR3G-6401CONN IC SOCKET 64POS Omron Electronics Inc-EMC Div |
7 |
|
规格书 |
- | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
XR2A-1411-NCONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
0 |
|
规格书 |
XR2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
