上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-1437504-0CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
8060 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8080-1G9CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
8080 | Bulk | Active | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
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1825088-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | Thermoplastic | -55°C ~ 125°C |
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8080-1G1-LFCONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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2-822114-4CONN SOCKET PQFP 160POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | QFP | 160 (4 x 40) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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2-822064-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | QFP | 132 (4 x 33) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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2-821949-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | QFP | 132 (4 x 33) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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1871554-1CONN SKT 1207-F RIGHT LEVER SMD TE Connectivity AMP Connectors |
5 |
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- |
- | Bulk | Obsolete | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | Gold | - | Copper Alloy | Thermoplastic | - |
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1437522-4CONN SOCKET PGA 321POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Bulk | Active | PGA | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Thermoplastic, Polyester | -55°C ~ 105°C |
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2-640357-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
