上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2-641604-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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2-641606-4CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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2-641616-2CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C |
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382438-1CONN SOCKET SIP 4POS TIN TE Connectivity AMP Connectors |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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382441-1CONN SOCKET SIP 7POS TIN TE Connectivity AMP Connectors |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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382444-1CONN SOCKET SIP 6POS TIN-LEAD TE Connectivity AMP Connectors |
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规格书 |
- | Tube | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | -55°C ~ 105°C |
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382444-2CONN SOCKET SIP 8POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 105°C |
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382444-3CONN SOCKET SIP 10POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | -55°C ~ 105°C |
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643641-6CONN SOCKET SIP 9POS TIN TE Connectivity AMP Connectors |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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643644-3CONN SOCKET SIP 12POS TIN TE Connectivity AMP Connectors |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
