上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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832-AG10DCONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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4-1437531-1CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
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2-5916783-1CONN SOCKET PGA ZIF 370POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
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8060-1G11CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
8060 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8080-1G16-LFCONN TRANSIST TO-3 3POS SILVER TE Connectivity AMP Connectors |
0 |
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规格书 |
8080 | Bulk | Active | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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1-1437504-1CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
8060 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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840-AG11DCONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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3-1437508-9CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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4-1437508-0CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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4-1437538-8CONN IC DIP SOCKET 64POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
