图片 | 型号 | 库存 | 数量 | 规格书 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 类型 | 输入类型 | 输出类型 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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ZSSC3123AI6BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
Die | cLite™ | Tray | Active | - | Capacitive Sensor | Capacitive | I2C, SPI | 1.1 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
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ZSSC3230BC3RPQFN / 24 / 4X4MM G1 - TAPE&REE Renesas Electronics Corporation |
0 |
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![]() 规格书 |
24-VFQFN Exposed Pad | - | Tape & Reel (TR) | Active | - | Capacitive Sensor | Analog, Digital | I2C, Serial | 1.1 mA | 0°C ~ 70°C (TA) | - | - | Surface Mount | 24-VFQFPN (4x4) |
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ZSSC3123AI6CDICE (WAFER SAWN) - FRAME Renesas Electronics Corporation |
0 |
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![]() 规格书 |
Die | cLite™ | Tray | Active | - | Capacitive Sensor | Capacitive | I2C, SPI | 1.1 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
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ZSC31014EABWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSC31015EABWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC3230BI3RPQFN / 24 / 4X4MM G1 - TAPE&REE Renesas Electronics Corporation |
0 |
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![]() 规格书 |
24-VFQFN Exposed Pad | - | Tape & Reel (TR) | Active | - | Capacitive Sensor | Analog, Digital | I2C, Serial | 1.1 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | 24-VFQFPN (4x4) |
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ZSSC5101BE1BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC4169DE1B-APCWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
24-VFQFN Exposed Pad | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Differential | 1-Wire® | - | -40°C ~ 150°C | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 24-QFN (4x4) |
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ZSSC3018BA2BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
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![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC3123AA6BOPN - WAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
Die | cLite™ | Tray | Active | - | Capacitive Sensor | Capacitive | I2C, SPI | 1.1 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Die |