图片 | 型号 | 库存 | 数量 | 规格书 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 类型 | 输入类型 | 输出类型 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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ZSSC3230BI1BWAFER UNSAWN, 304 Renesas Electronics Corporation |
0 |
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![]() 规格书 |
Die | - | Tray | Active | - | Capacitive Sensor | Analog, Digital | I2C, Serial | 1.1 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Die |
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ZSSC3224BI1BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC3224BI2BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSC31010CIBWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC3224BI1CDICE (WAFER SAWN) - FRAME Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - |
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RAA2S4251B5HWT#FF0WAFER UNSAWN Renesas Electronics Corporation |
0 |
|
- |
Die | - | Tray | Active | - | Signal Conditioner | - | 1-Wire®, I2C | - | -40°C ~ 150°C | - | - | Surface Mount | Wafer |
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ZSSC4161DE1BUNSAWN WAFER IN WAFER BOX Renesas Electronics Corporation |
0 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - |
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RAA2S4251B5HWT#FF1DIE ON FRAME Renesas Electronics Corporation |
0 |
|
- |
Die | - | Tray | Active | - | Signal Conditioner | - | 1-Wire®, I2C | - | -40°C ~ 150°C | - | - | Surface Mount | Wafer |
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ZSSC3123AI1BWAFER (UNSAWN) - BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
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ZSSC3123AI3BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
![]() 规格书 |
- | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |