传感器和探测器接口

    制造商 封装/外壳 系列 包装 产品状态 可编程 类型 输入类型 输出类型 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装



































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 封装/外壳 系列 包装 产品状态 可编程 类型 输入类型 输出类型 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    ZSSC3241DI1C

    ZSSC3241DI1C

    WAFER (SAWN) - FRAME

    Renesas Electronics Corporation

    0
    ZSSC3241DI1C

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DI5B

    ZSSC3241DI5B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3241DI5B

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DL5B

    ZSSC3241DL5B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3241DL5B

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DI5C

    ZSSC3241DI5C

    WAFER (SAWN) - FRAME

    Renesas Electronics Corporation

    0
    ZSSC3241DI5C

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DL1B

    ZSSC3241DL1B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3241DL1B

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DI1B

    ZSSC3241DI1B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3241DI1B

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3241DL5C

    ZSSC3241DL5C

    WAFER (SAWN) - FRAME

    Renesas Electronics Corporation

    0
    ZSSC3241DL5C

    规格书

    Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
    ZSSC3240CC6B

    ZSSC3240CC6B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3240CC6B

    规格书

    Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
    ZSSC3240CC5B

    ZSSC3240CC5B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3240CC5B

    规格书

    Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
    ZSSC3240CC2B

    ZSSC3240CC2B

    WAFER (UNSAWN) - WAFER BOX

    Renesas Electronics Corporation

    0
    ZSSC3240CC2B

    规格书

    Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
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