上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD4300AX10T4SLDR PST WATR SOL 63/37 T4 10CC Chip Quik Inc. |
12 |
|
规格书 |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
6 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2024-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
7 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
NC2SW.015 4OZSOLDER WIRE 60/40 TIN/LEAD (SN60 Chip Quik Inc. |
8 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
|
RASW.031 8OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
10 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
BARSN60PB40SOLDER BAR SN60/PB40 1LB SUPER L Chip Quik Inc. |
6 |
|
规格书 |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
|
SMD2020-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
9 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
RASW.020 8OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
12 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMDIN100-0.4MMINDIUM SOLDER WIRE (IN100) 0.016 Chip Quik Inc. |
16 |
|
规格书 |
CHIPQUIK® | Bulk | Active | Wire Solder | In100 (100) | 0.016" (0.40mm) | 315°F (157°C) | No-Clean | - | - | Lead Free | Spool | 60 Months | Date of Manufacture | - |
|
SMD291SNL10T4SLDR PST NO-CLEAN SAC305 T4 10CC Chip Quik Inc. |
14 |
|
规格书 |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
