IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    AW 127-13/Z-T

    AW 127-13/Z-T

    SOCKET 13 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    AW 127-13/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    SIP1X07-014B

    SIP1X07-014B

    SIP1X07-014B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    0
    SIP1X07-014B

    规格书

    SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X06-001B

    SIP1X06-001B

    SIP1X06-001B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    0
    SIP1X06-001B

    规格书

    SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-87-304-41-006101

    116-87-304-41-006101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    116-87-304-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-20

    232-20

    CONN SOCKET PLCC 20POS TIN

    CNC Tech

    0
    232-20

    规格书

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
    02-1518-10

    02-1518-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    02-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP41430-001LF

    SIP41430-001LF

    CONN SOCKET SIP 2POS TIN

    Amphenol ICC (FCI)

    0
    SIP41430-001LF

    规格书

    - Tape & Reel (TR) Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyamide (PA), Nylon -
    A 28-LC/7-T

    A 28-LC/7-T

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    0
    A 28-LC/7-T

    规格书

    - Box Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    232-32

    232-32

    CONN SOCKET PLCC 32POS TIN

    CNC Tech

    0
    232-32

    规格书

    - Tube Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
    AW 127-14/Z-T

    AW 127-14/Z-T

    SOCKET 14 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    AW 127-14/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    SIP050-1X04-157B

    SIP050-1X04-157B

    1X04-157B-SIP SOCKET 4 CTS

    Amphenol ICC (FCI)

    0
    SIP050-1X04-157B

    规格书

    SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-304-41-018101

    116-87-304-41-018101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    116-87-304-41-018101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X07-011B

    SIP1X07-011B

    SIP1X07-011B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    0
    SIP1X07-011B

    规格书

    SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    115-83-304-41-001101

    115-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR06-HZL/07-TT

    AR06-HZL/07-TT

    CONN IC DIP SOCKET 6POS GOLD

    Assmann WSW Components

    0
    AR06-HZL/07-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    232-28

    232-28

    CONN SOCKET PLCC 28POS TIN

    CNC Tech

    0
    232-28

    规格书

    - Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
    A16-LCG

    A16-LCG

    CONN IC DIP SOCKET 16POS GOLD

    Assmann WSW Components

    0

    -

    - - Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    AR08-HZL/01-TT

    AR08-HZL/01-TT

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    0
    AR08-HZL/01-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    HLS-0101-T-2

    HLS-0101-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    HLS-0101-T-2

    规格书

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-87-304-31-012101

    614-87-304-31-012101

    CONN IC DIP SOCKET 320POS GOLD

    Preci-Dip

    0
    614-87-304-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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