上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-390261-7CONN IC DIP SOCKET 22POS TIN |
0 |
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规格书 |
- | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
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AW 127-07/Z-TSOCKET 7 CONTACTS SINGLE ROW |
0 |
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规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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ICO-406-S8A-TCONN IC DIP SOCKET 40POS TIN |
0 |
|
规格书 |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
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ICO-406-S8-TCONN IC DIP SOCKET 40POS TIN |
0 |
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规格书 |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
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390262-2CONN IC DIP SOCKET 28POS TIN |
0 |
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规格书 |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole, Right Angle, Vertical | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | - | -40°C ~ 105°C |
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4828-3000-CPCONN IC DIP SOCKET 28POS TIN |
0 |
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规格书 |
4800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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A06-LCG-TCONN IC DIP SOCKET 6POS GOLD |
0 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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SIP050-1X02-157B1X02-157B-SIP SOCKET 2 CTS |
0 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
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A08-LCGCONN IC DIP SOCKET 8POS GOLD |
0 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
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390263-7CONN IC DIP SOCKET 24POS TINLEAD |
0 |
|
规格书 |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | - | -40°C ~ 105°C |
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110-87-304-41-005101CONN IC DIP SOCKET 4POS GOLD |
0 |
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规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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SIP1X05-014BSIP1X05-014B-SIP SOCKET 5 CTS |
0 |
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规格书 |
SIP1x | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X04-014BSIP1X04-014B-SIP SOCKET 4 CTS |
0 |
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规格书 |
SIP1x | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X04-011BSIP1X04-011B-SIP SOCKET 4 CTS |
0 |
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规格书 |
SIP1x | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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WMS-060ZCONN IC DIP SOCKET 6POS GOLD |
0 |
|
规格书 |
WMS | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - | -40°C ~ 105°C |
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XR2C-2000-HSGCONN IC SOCKET 20POS |
0 |
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规格书 |
XR2 | Bulk | Obsolete | Housing | 20 (1 x 20) | 0.100" (2.54mm) | - | - | Beryllium Copper | - | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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A22-LC-TRCONN IC DIP SOCKET 22POS TIN |
0 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
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AR 10-HZL-TTCONN IC DIP SOCKET 10POS GOLD |
0 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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AW 127-08/Z-TSOCKET 8 CONTACTS SINGLE ROW |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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SIP050-1X02-160B1X02-160B-SIP SOCKET 2 CTS |
0 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
