IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-41-652-41-001000

    116-41-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    116-41-652-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-652-41-001000

    116-91-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    116-91-652-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-0511-11

    32-0511-11

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    0
    32-0511-11

    规格书

    511 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-43-210-61-001000

    110-43-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-310-61-001000

    111-43-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-310-61-001000

    111-93-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1936-T-R

    APH-1936-T-R

    APH-1936-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0836-T-R

    APH-0836-T-R

    APH-0836-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0636-T-R

    APH-0636-T-R

    APH-0636-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1636-T-R

    APH-1636-T-R

    APH-1636-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0336-T-R

    APH-0336-T-R

    APH-0336-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0436-T-R

    APH-0436-T-R

    APH-0436-T-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    126-41-650-41-002000

    126-41-650-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    126-41-650-41-002000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-650-41-002000

    126-91-650-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    126-91-650-41-002000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-952-31-002000

    614-43-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    614-43-952-31-002000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-952-31-002000

    614-93-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    614-93-952-31-002000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-101-13-061001

    510-93-101-13-061001

    PGA SOCK 101PIN 13X13 SOLDER TL

    Mill-Max Manufacturing Corp.

    0

    -

    510 Tube Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-632-G-A

    APA-632-G-A

    ADAPTER PLUG

    Samtec Inc.

    0
    APA-632-G-A

    规格书

    APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-632-G-A

    APO-632-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    APO-632-G-A

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    614-93-952-31-007000

    614-93-952-31-007000

    SOCKET CARRIER LOWPRO .900 52POS

    Mill-Max Manufacturing Corp.

    0
    614-93-952-31-007000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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