上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2-822114-4CONN SOCKET PQFP 160POS TIN-LEAD |
0 |
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规格书 |
- | Tube | Obsolete | QFP | 160 (4 x 40) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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122-11-640-41-001000CONN IC SKT DBL |
0 |
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规格书 |
122 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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1051420133CONN SOCKET LGA 2011POS GOLD |
0 |
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规格书 |
105142 | Tray | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
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115-44-636-61-003000CONN IC SKT DBL |
0 |
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- |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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110-44-650-61-001000CONN IC SKT DBL |
0 |
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- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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612-43-636-41-004000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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612-93-636-41-004000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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40-6621-30CONN IC DIP SOCKET 40POS TIN |
0 |
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规格书 |
6621 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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612-41-950-41-001000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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612-91-950-41-001000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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42-3570-10CONN IC DIP SOCKET ZIF 42POS TIN |
0 |
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规格书 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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110-43-318-61-105000CONN IC SKT DBL |
0 |
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- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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48-6823-90TCONN IC DIP SOCKET 48POS TIN |
0 |
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规格书 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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110-91-636-61-001000CONN IC SKT DBL |
0 |
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- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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115-44-428-61-003000CONN IC SKT DBL |
0 |
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- |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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612-11-636-41-001000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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121-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
0 |
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规格书 |
121 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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30-3503-21CONN IC DIP SOCKET 30POS GOLD |
0 |
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规格书 |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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30-3503-31CONN IC DIP SOCKET 30POS GOLD |
0 |
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规格书 |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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612-41-650-41-003000SKT CARRIER SOLDRTL |
0 |
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规格书 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
