图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
2255-929A-90-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
|
- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
![]() |
2320-9220-02-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
|
- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
![]() |
2432-9235-01-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
|
- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
![]() |
2256-6321-9UA-1902GRID ZIP 21 X 21 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 256 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
276-6321-9UA-1902TEST BURN-IN PGA 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 76 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
2124-6313-9UA-1902TEST BURN-IN PGA 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 124 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
2209-6317-9UA-1902GRID ZIP 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 209 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
2225-6317-9UA-1902TEXTOOL 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
2120-6313-9UA-1902PGA 13 X13 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 120 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
![]() |
2361-6319-9UA-1902GRID ZIP 19 X 19 3M |
0 |
|
![]() 规格书 |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |