上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
799288-1CONN IC DIP SOCKET 16POS TINLEAD TE Connectivity AMP Connectors |
0 |
|
规格书 |
- | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | 3.00µin (0.076µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin-Lead | 5.00µin (0.127µm) | Brass | Thermoplastic, Polyester, Glass Filled | - |
|
|
3-822516-6CONN SOCKET PLCC 84POS TIN TE Connectivity AMP Connectors |
0 |
|
规格书 |
- | Tape & Reel (TR) | Active | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
|
|
1-1437540-4CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
8058-1G23CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
8058 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
1825046-2CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors |
0 |
|
- |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | - |
|
|
8060-1G3CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
8060 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
522-AG10DCONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
|
7-1437532-1CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Polyester | -55°C ~ 125°C |
|
|
1-1571550-0CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
532-AG10DCONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Polyester | -55°C ~ 125°C |
