上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
524-AG10D-ESCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
|
|
2-1437542-2CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
|
|
816-AG10DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
528-AG10D-ESCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
|
|
848-AG11D-ESCONN IC DIP SOCKET 48POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
5-1437536-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
|
|
916657-3CONN SOCKET PGA ZIF 321POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
8080-1G13CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
0 |
|
规格书 |
8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
2-1437542-7CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
|
|
7-1437529-6CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
0 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
