上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1814655-5CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Bulk | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
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9-1437535-1CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | - | -55°C ~ 125°C |
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814-AG11DCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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7-1437539-0CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.5 to 0.6" Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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1571540-1CONN SOCKET PLCC 32POS TIN TE Connectivity AMP Connectors |
0 |
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- |
- | Bulk | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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3-822516-2CONN SOCKET PLCC 28POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tape & Reel (TR) | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
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2-641612-2CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C |
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2-641932-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C |
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4-382568-8CONN IC DIP SOCKET 48POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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1-1825108-1CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
