上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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822472-7CONN SOCKET PLCC 84POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin-Lead | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | - |
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643648-1CONN SOCKET SIP 16POS TIN TE Connectivity AMP Connectors |
0 |
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- |
Diplomate DL | Tray | Obsolete | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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643652-3CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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1571539-1CONN SOCKET PLCC 20POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Bulk | Obsolete | PLCC | 20 (4 x 5) | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 125°C |
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2-640358-2CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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643642-2CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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814-AG11D-ESLCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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1814640-6CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
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2-1437539-9CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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516-AG11D-ESDIP SOCKET T/H 16POS TE Connectivity AMP Connectors |
0 |
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规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
