图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33FS6520CAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6515LAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6505LAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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TEA2209T/1JIC ACTIVE BRIDGE CTRL SO16 NXP USA Inc. |
2,315 |
|
![]() 规格书 |
- | 16-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | Desktop, Notebook PCs | 2mA | 440V | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 16-SO |
|
MFS8600BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MC33FS6515CAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
![]() |
MC33FS6520LAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MFS2621AMDABADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MPF7100BMBA0ESPF7100 PMIC OTP NXP USA Inc. |
256 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC35FS6505CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
![]() 规格书 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |