电源管理 - 专用

    制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    MPF5023AMBA0ES

    MPF5023AMBA0ES

    POWER MANAGEMENT IC, PRE-PROG, 3

    NXP USA Inc.

    490

    -

    - 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
    MFS2401AVBA0ES

    MFS2401AVBA0ES

    MFS2401AVBA0ES

    NXP USA Inc.

    490
    MFS2401AVBA0ES

    规格书

    - 32-VFQFN Exposed Pad Bulk Active System Basis Chip - 5.5V ~ 40V -40°C ~ 115°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)
    MFS2401AVBA1ES

    MFS2401AVBA1ES

    Safety Mini CAN FD SBC

    NXP USA Inc.

    135
    MFS2401AVBA1ES

    规格书

    - 32-VFQFN Exposed Pad Tray Active System Basis Chip - 5.5V ~ 40V -40°C ~ 115°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)
    MC34PF1550A0EP

    MC34PF1550A0EP

    POWER MANAGEMENT IC 3 BUCK REGS

    NXP USA Inc.

    490

    -

    - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
    MC34PF1550A1EP

    MC34PF1550A1EP

    POWER MANAGEMENT IC: 3 BUCK REGS

    NXP USA Inc.

    490

    -

    - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
    MC34PF1550A2EP

    MC34PF1550A2EP

    POWER MANAGEMENT IC: 3 BUCK REGS

    NXP USA Inc.

    490

    -

    - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
    MC34PF1550A3EP

    MC34PF1550A3EP

    POWER MANAGEMENT IC: 3 BUCK REGS

    NXP USA Inc.

    490

    -

    - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
    MFS2320BMBA0EP

    MFS2320BMBA0EP

    MFS2320BMBA0EP

    NXP USA Inc.

    255
    MFS2320BMBA0EP

    规格书

    - 48-VFQFN Exposed Pad Tray Active System Basis Chip 30µA 5.5V ~ 40V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
    MC33FS4500NAE

    MC33FS4500NAE

    SYSTEM BASIS CHIP LINEAR 0.5A V

    NXP USA Inc.

    250
    MC33FS4500NAE

    规格书

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
    MPF5023CMBA0ES

    MPF5023CMBA0ES

    POWER MANAGEMENT IC, PRE-PROG, 3

    NXP USA Inc.

    490
    MPF5023CMBA0ES

    规格书

    - 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
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