系统级芯片(SoC)

    制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
    TDA4VL21HGAALZRQ1

    TDA4VL21HGAALZRQ1

    AUTOMOTIVE SYSTEM-ON-A-CHIP WITH

    Texas Instruments

    238
    TDA4VL21HGAALZRQ1

    规格书

    - 770-BFBGA, FCBGA Tape & Reel (TR) Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1GHz - -40°C ~ 125°C (TJ) Automotive AEC-Q100 770-FCBGA (23x23)
    TDA4AL88TGAALZRQ1

    TDA4AL88TGAALZRQ1

    AUTOMOTIVE SYSTEM-ON-A-CHIP FOR

    Texas Instruments

    210
    TDA4AL88TGAALZRQ1

    规格书

    - 770-BFBGA, FCBGA Tape & Reel (TR) Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1GHz - -40°C ~ 125°C (TJ) Automotive AEC-Q100 770-FCBGA (23x23)
    DRA829JMTGBALFR

    DRA829JMTGBALFR

    DUAL ARM CORTEX-A72, QUAD CORTEX

    Texas Instruments

    250
    DRA829JMTGBALFR

    规格书

    - 827-BFBGA, FCBGA Tape & Reel (TR) Last Time Buy DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ) - - 827-FCBGA (24x24)
    TDA4VE88TGAALZRQ1

    TDA4VE88TGAALZRQ1

    AUTOMOTIVE SYSTEM-ON-A-CHIP FOR

    Texas Instruments

    175
    TDA4VE88TGAALZRQ1

    规格书

    - 770-BFBGA, FCBGA Tape & Reel (TR) Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 2MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1GHz - -40°C ~ 125°C (TJ) Automotive AEC-Q100 770-FCBGA (23x23)
    TDA4VM88TGBALFR

    TDA4VM88TGBALFR

    NEXT GENERATION SOC FAMILY FOR L

    Texas Instruments

    494
    TDA4VM88TGBALFR

    规格书

    - 827-BFBGA, FCBGA Tape & Reel (TR) Last Time Buy DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ) Automotive AEC-Q100 827-FCBGA (24x24)
    TDA4VM88TGBALFRQ1

    TDA4VM88TGBALFRQ1

    NEXT GENERATION SOC FAMILY FOR L

    Texas Instruments

    218
    TDA4VM88TGBALFRQ1

    规格书

    - 827-BFBGA, FCBGA Tape & Reel (TR) Last Time Buy DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 125°C (TJ) Automotive AEC-Q100 827-FCBGA (24x24)
    WDC6202GJL250X

    WDC6202GJL250X

    WIRELESS 27MM 6202 WITH XBUS

    Texas Instruments

    80

    -

    * - Bulk Active - - - - - - - - - - - -
    DRA821U2CGBALMR

    DRA821U2CGBALMR

    DUAL ARM CORTEX-A72 QUAD CORTEX

    Texas Instruments

    0
    DRA821U2CGBALMR

    规格书

    Jacinto™ 433-BFBGA, FCBGA Tape & Reel (TR) Active MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F - 1.5MB DMA, PWM, WDT Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB 750MHz, 500MHz - -40°C ~ 105°C (TJ) - - 433-FCBGA (17.2x17.2)
    DRA821U2CGBALM

    DRA821U2CGBALM

    DUAL ARM CORTEX-A72 QUAD CORTEX

    Texas Instruments

    0
    DRA821U2CGBALM

    规格书

    Jacinto™ 433-BFBGA, FCBGA Bulk Active MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F - 1.5MB DMA, PWM, WDT Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB 750MHz, 500MHz - -40°C ~ 105°C (TJ) - - 433-FCBGA (17.2x17.2)
    TDA3MVRBFABFRQ1

    TDA3MVRBFABFRQ1

    IC SOC PROCESSOR

    Texas Instruments

    0
    TDA3MVRBFABFRQ1

    规格书

    - 367-BFBGA, FCBGA Tape & Reel (TR) Active DSP, MPU ARM® Cortex®-M4, C66x - 512kB DMA, PWM, WDT CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB 212.8MHz, 745MHz - -40°C ~ 125°C (TJ) - - 367-FCBGA (15x15)
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