现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    AGL400V2-FGG256I

    AGL400V2-FGG256I

    IC FPGA 178 I/O 256FBGA

    Microchip Technology

    0
    AGL400V2-FGG256I

    规格书

    IGLOO 256-LBGA Tray Active Not Verified - 9216 55296 178 400000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
    A40MX02-1PLG44

    A40MX02-1PLG44

    IC FPGA 34 I/O 44PLCC

    Microchip Technology

    0
    A40MX02-1PLG44

    规格书

    MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)
    M1A3P600-FG484I

    M1A3P600-FG484I

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    M1A3P600-FG484I

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
    M1A3P600-FGG484I

    M1A3P600-FGG484I

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    M1A3P600-FGG484I

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
    A54SX16A-FTQG144

    A54SX16A-FTQG144

    IC FPGA 113 I/O 144TQFP

    Microchip Technology

    0
    A54SX16A-FTQG144

    规格书

    SX-A 144-LQFP Tray Active Not Verified 1452 - - 113 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
    A54SX16A-FTQG100

    A54SX16A-FTQG100

    IC FPGA 81 I/O 100TQFP

    Microchip Technology

    0
    A54SX16A-FTQG100

    规格书

    SX-A 100-LQFP Tray Active Not Verified 1452 - - 81 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
    M1A3P1000-FG144

    M1A3P1000-FG144

    IC FPGA 97 I/O 144FBGA

    Microchip Technology

    0

    -

    ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
    A3P1000-FG144

    A3P1000-FG144

    IC FPGA 97 I/O 144FBGA

    Microchip Technology

    0
    A3P1000-FG144

    规格书

    ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
    M1A3P1000-FGG144

    M1A3P1000-FGG144

    IC FPGA 97 I/O 144FBGA

    Microchip Technology

    0

    -

    ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
    M1A3P600-2FGG484

    M1A3P600-2FGG484

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    M1A3P600-2FGG484

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
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