现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    M2GL025TS-1FCS325I

    M2GL025TS-1FCS325I

    IC FPGA 180 I/O 325BGA

    Microchip Technology

    0
    M2GL025TS-1FCS325I

    规格书

    IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
    M2GL025TS-1FCSG325I

    M2GL025TS-1FCSG325I

    IC FPGA 180 I/O 324CSBGA

    Microchip Technology

    0
    M2GL025TS-1FCSG325I

    规格书

    IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
    A3P600-1FGG484

    A3P600-1FGG484

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    A3P600-1FGG484

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    A3P600-1FG484

    A3P600-1FG484

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    A3P600-1FG484

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    M1A3P600-1FG484

    M1A3P600-1FG484

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    M1A3P600-1FG484

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    M1A3P600-1FGG484

    M1A3P600-1FGG484

    IC FPGA 235 I/O 484FBGA

    Microchip Technology

    0
    M1A3P600-1FGG484

    规格书

    ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    M2GL025-1FG484

    M2GL025-1FG484

    IC FPGA 267 I/O 484FBGA

    Microchip Technology

    0
    M2GL025-1FG484

    规格书

    IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    M2GL025-1FGG484

    M2GL025-1FGG484

    IC FPGA 267 I/O 484FBGA

    Microchip Technology

    0
    M2GL025-1FGG484

    规格书

    IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
    M2GL025-FG484I

    M2GL025-FG484I

    IC FPGA 267 I/O 484FBGA

    Microchip Technology

    0
    M2GL025-FG484I

    规格书

    IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
    M1A3P600-2FG256I

    M1A3P600-2FG256I

    IC FPGA 177 I/O 256FBGA

    Microchip Technology

    0
    M1A3P600-2FG256I

    规格书

    ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
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