现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    MPF300TS-FC784M

    MPF300TS-FC784M

    MPF300TS-FC784M

    Microchip Technology

    0
    MPF300TS-FC784M

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 784-FCBGA (29x29)
    MPF200T-FCSG325T2

    MPF200T-FCSG325T2

    MPF200T-FCSG325T2

    Microchip Technology

    0
    MPF200T-FCSG325T2

    规格书

    PolarFire™ 325-TFBGA Tray Active Not Verified - 192000 13946061 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 325-BGA (11x11)
    MPF300T-1FCVG484T2

    MPF300T-1FCVG484T2

    MPF300T-1FCVG484T2

    Microchip Technology

    0
    MPF300T-1FCVG484T2

    规格书

    PolarFire™ 484-BFBGA Tray Active Not Verified - 300000 21600666 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
    MPF100T-1FCG484T2

    MPF100T-1FCG484T2

    MPF100T-1FCG484T2

    Microchip Technology

    0
    MPF100T-1FCG484T2

    规格书

    PolarFire™ 484-BGA Tray Active Not Verified - 109000 7969178 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
    MPF050T-FCSG325T2

    MPF050T-FCSG325T2

    MPF050T-FCSG325T2

    Microchip Technology

    0

    -

    - 325-TFBGA Tray Active Not Verified - 48000 3774874 164 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 325-BGA (11x11)
    MPF050T-1FCVG484T2

    MPF050T-1FCVG484T2

    MPF050T-1FCVG484T2

    Microchip Technology

    0

    -

    - 484-BFBGA Tray Active Not Verified - 48000 3774874 176 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
    MPF050T-FCVG484T2

    MPF050T-FCVG484T2

    MPF050T-FCVG484T2

    Microchip Technology

    0

    -

    - 484-BFBGA Tray Active Not Verified - 48000 3774874 176 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
    RT4G150-1CGG1657R

    RT4G150-1CGG1657R

    RT4G150-1CGG1657R

    Microchip Technology

    0

    -

    RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
    RT4G150-CQG352M

    RT4G150-CQG352M

    RT4G150-CQG352M

    Microchip Technology

    0

    -

    RTG4™ 352-BFCQFP Exposed Pad and Tie Bar Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 352-QFP (48x48)
    RT4G150-CGG1657B

    RT4G150-CGG1657B

    RT4G150-CGG1657B

    Microchip Technology

    0

    -

    RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
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