上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-7068-6407SOLDER FLUX-CORED/331 .024" 1LB |
0 |
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规格书 |
331 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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4860P-500GLEADED SOLDER PASTE, SN63/PB37, |
0 |
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规格书 |
4860 | Bulk | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) |
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24-7050-0066SOLDER FLUX-CORED/44 .093" 1LB S |
0 |
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规格书 |
44 | Bulk | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.093" (2.36mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7040-8834SOLDER FLUX-CORED/245 .020 1LB S |
0 |
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规格书 |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-7617SOLDER FLUX-CORED/275 .025" 500G |
0 |
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规格书 |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7340-9700SOLDER FLUX-CORED/285 .020" 1LB |
0 |
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规格书 |
285 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7068-9702SN96.5AG03CU.5 3.3%/285 .020 |
0 |
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规格书 |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | - | Rosin Mildly Activated (RMA) | - | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
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SMD2050SOLDER SPHERES SAC305 .024 DIAM |
0 |
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规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024" (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
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SMD2055SOLDER SPHERES SAC305 .025 DIAM |
0 |
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规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
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92-7068-8825SOLDER FLUX-CORED/245 .040 500G |
0 |
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规格书 |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-9014SOLDER FLUX-CORED/245 .031" 500G |
0 |
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规格书 |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-1003-0510SOLDER PASTE WATER SOLUBLE 500GM |
0 |
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规格书 |
HydroMark 531 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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24-7150-8806SOLDER FLUX-CORED/245 .015" 1LB |
0 |
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规格书 |
245 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7050-0061SOLDER FLUX-CORED/44 .062" 1LB S |
0 |
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规格书 |
44 | Bulk | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.062" (1.57mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-0202-0510SOLDER PASTE NO CLEAN 500GM |
0 |
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规格书 |
EP256HA | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0102-0510SOLDERPASTE NO CLEAN 63/37 500GM |
0 |
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规格书 |
Profile®, 256 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-2102-0510R562 SOLDERPASTE WATER SOL 500G |
0 |
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规格书 |
R562 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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24-6337-7400SOLDER FLUX-CORED/282 63/37.020" |
0 |
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规格书 |
282 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
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1405650LOCTITE WS 300 97SCDAP88V 500G J |
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WS300 | Bulk | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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1405673LOCTITE WS 300 97SCDAP88V 500G S |
0 |
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WS300 | Bulk | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
