上传BOM
焊料
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMD291SNLT6SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
0 |
|
规格书 |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.020 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3 |
|
规格书 |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
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NC191LTA250SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
1 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC2SWLF.020 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
0 |
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规格书 |
- | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
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NC3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
1 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
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NC191SNL250T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
1 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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TS391AX500CTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
0 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
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SMD291SNL50T6SOLDER PASTE IN JAR 50G (T6) SAC Chip Quik Inc. |
1 |
|
规格书 |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD4300SNL250T5SOLDER PASTE SAC305 250G T5 Chip Quik Inc. |
0 |
|
规格书 |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD2020SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
1 |
|
规格书 |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
