IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    10-8535-210C

    10-8535-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    0
    10-8535-210C

    规格书

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8810-210C

    10-8810-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    0
    10-8810-210C

    规格书

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8500-611C

    14-8500-611C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    14-8500-611C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    1108883-05

    1108883-05

    SERIES 0517 PIN-LINE VERTISOCKET

    Aries Electronics

    0
    1108883-05

    规格书

    - - Active - - - - - - - - - - - - - - -
    1109800-14

    1109800-14

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    1109800-14

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-16

    1109800-16

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    1109800-16

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-20

    1109800-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    1109800-20

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-28

    1109800-28

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    1109800-28

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-10

    1109800-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    0
    1109800-10

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-12

    1109800-12

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    1109800-12

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-22

    1109800-22

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    0
    1109800-22

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-24

    1109800-24

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    1109800-24

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-26

    1109800-26

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    0
    1109800-26

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-8

    1109800-8

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    1109800-8

    规格书

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-308

    1109681-308

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    1109681-308

    规格书

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-316

    1109681-316

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    1109681-316

    规格书

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-632

    1109681-632

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    1109681-632

    规格书

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-648

    1109681-648

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    0
    1109681-648

    规格书

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    54020-68030LF

    54020-68030LF

    CONN SOCKET PLCC 68POS TIN

    Amphenol ICC (FCI)

    0
    54020-68030LF

    规格书

    - Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    54020-52030LF

    54020-52030LF

    CONN SOCKET PLCC 52POS TIN

    Amphenol ICC (FCI)

    0
    54020-52030LF

    规格书

    - Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
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