上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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7100285589TEXTOOLFLEXIBLE ARRAY SOLUTIONS |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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1040-2-1517-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7100229933TEXTOOL TEST & BURN BALL GRID AR |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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1035-2-1152-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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1025-2-0572-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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84-537-21-7CONN SOCKET PLCC ZIF 84POS GOLD |
0 |
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规格书 |
537 | - | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12.0µin (0.30µm) | - | - | Closed Frame | - | - | - | - | - | - | - |
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209-PGM17030-11CONN SOCKET PGA GOLD |
0 |
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规格书 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
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209-PGM17046-11CONN SOCKET PGA GOLD |
0 |
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规格书 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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79300-20-0093M TEXTOOL FLEXIBLE ARRAY SOLUTI |
0 |
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- |
Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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S583-11-255-01-005410255 POSITION BGA SOCKET LOADED W |
1 |
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- |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7100287881TEXTOOLFLEXIBLE ARRAY SOLUTIONS |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7010390893983-10 DOT IN-LN2"ES 6"X150YD-IN |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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523-93-144-15-082001PGA SOCK 144PIN 15X15 WIRE WRAP |
0 |
|
规格书 |
523 | Bulk | Active | PGA | 144 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
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523-93-114-13-062001PGA SOCK 114PIN 13X13 WIRE WRAP |
0 |
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规格书 |
523 | Bulk | Active | PGA | 114 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
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2-640357-4CONN IC DIP SOCKET 14POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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2-640358-4CONN IC DIP SOCKET 16POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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2-640359-4CONN IC DIP SOCKET 18POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
|
|
2-640464-4CONN IC DIP SOCKET 20POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
2-640362-4CONN IC DIP SOCKET 28POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
2-640379-4CONN IC DIP SOCKET 40POS GOLD |
0 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
