IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    133-PGM14014-50

    133-PGM14014-50

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    133-PGM14014-50

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0840-G-T

    APH-0840-G-T

    APH-0840-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1340-G-T

    APH-1340-G-T

    APH-1340-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0940-G-T

    APH-0940-G-T

    APH-0940-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0440-G-T

    APH-0440-G-T

    APH-0440-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1840-G-T

    APH-1840-G-T

    APH-1840-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0540-G-T

    APH-0540-G-T

    APH-0540-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0640-G-T

    APH-0640-G-T

    APH-0640-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1740-G-T

    APH-1740-G-T

    APH-1740-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0740-G-T

    APH-0740-G-T

    APH-0740-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1140-G-T

    APH-1140-G-T

    APH-1140-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    510-13-096-11-041001

    510-13-096-11-041001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    510-13-096-11-041001

    规格书

    510 Tube Active PGA 96 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-40

    28-6556-40

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    28-6556-40

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-964-61-008000

    116-43-964-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-008000

    116-93-964-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0520-G-2

    HLS-0520-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    HLS-0520-G-2

    规格书

    HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    550-10-352M26-001166

    550-10-352M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    0
    550-10-352M26-001166

    规格书

    550 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    HLS-0420-G-10

    HLS-0420-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    HLS-0420-G-10

    规格书

    HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    APH-0932-G-T

    APH-0932-G-T

    APH-0932-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1532-G-T

    APH-1532-G-T

    APH-1532-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
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