IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    510-93-145-15-081002

    510-93-145-15-081002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    510-93-145-15-081002

    规格书

    510 Tube Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-225-18-091101

    550-10-225-18-091101

    PGA SOLDER TAIL

    Preci-Dip

    0
    550-10-225-18-091101

    规格书

    550 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6556-21

    48-6556-21

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    0
    48-6556-21

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    120-PGM13015-11

    120-PGM13015-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    120-PGM13015-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    517-83-463-19-101111

    517-83-463-19-101111

    CONN SOCKET PGA 463POS GOLD

    Preci-Dip

    0
    517-83-463-19-101111

    规格书

    517 Bulk Active PGA 463 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0430-G-T

    APH-0430-G-T

    APH-0430-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1430-G-T

    APH-1430-G-T

    APH-1430-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1930-G-T

    APH-1930-G-T

    APH-1930-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1630-G-T

    APH-1630-G-T

    APH-1630-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0830-G-T

    APH-0830-G-T

    APH-0830-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1130-G-T

    APH-1130-G-T

    APH-1130-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1730-G-T

    APH-1730-G-T

    APH-1730-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    ICO-648-JGG

    ICO-648-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    ICO-648-JGG

    规格书

    ICO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APH-1338-G-T

    APH-1338-G-T

    APH-1338-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1838-G-T

    APH-1838-G-T

    APH-1838-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1438-G-T

    APH-1438-G-T

    APH-1438-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1038-G-T

    APH-1038-G-T

    APH-1038-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1938-G-T

    APH-1938-G-T

    APH-1938-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1538-G-T

    APH-1538-G-T

    APH-1538-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1738-G-T

    APH-1738-G-T

    APH-1738-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    首页

    首页

    产品中心

    产品中心

    电话

    电话

    会员中心

    会员中心