IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-13-952-61-001000

    110-13-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-6556-31

    42-6556-31

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    0
    42-6556-31

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    42-6556-21

    42-6556-21

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    0
    42-6556-21

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    714-43-262-31-018000

    714-43-262-31-018000

    CONN IC DIP SOCKET 62POS GOLD

    Mill-Max Manufacturing Corp.

    0
    714-43-262-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 62 (2 x 31) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-648-G-C

    APA-648-G-C

    ADAPTER PLUG

    Samtec Inc.

    0
    APA-648-G-C

    规格书

    APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0432-G-H

    APH-0432-G-H

    APH-0432-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0532-G-H

    APH-0532-G-H

    APH-0532-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0632-G-H

    APH-0632-G-H

    APH-0632-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0232-G-H

    APH-0232-G-H

    APH-0232-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1332-G-H

    APH-1332-G-H

    APH-1332-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0732-G-H

    APH-0732-G-H

    APH-0732-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1132-G-H

    APH-1132-G-H

    APH-1132-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1232-G-H

    APH-1232-G-H

    APH-1232-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1732-G-H

    APH-1732-G-H

    APH-1732-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1632-G-H

    APH-1632-G-H

    APH-1632-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    117-93-764-61-005000

    117-93-764-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-064-08-000001

    510-13-064-08-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    510-13-064-08-000001

    规格书

    510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-G-H

    APO-640-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    APO-640-G-H

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1024-G-H

    APH-1024-G-H

    APH-1024-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1124-G-H

    APH-1124-G-H

    APH-1124-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
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